| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board with high reliability and excellent via-connection stability. <P>SOLUTION: A penetrating hole 4 is formed at a predetermined position of a prepreg 3 that is laminated, using the laser processing method. Thereafter, conductive paste 6 is filled in the penetrating hole 4, and a PET sheet 2 is peeled away. Then, in a process of removing the residual stress of the prepreg, in which the temperature and the humidity are set at 30°C and 80%RH, respectively, the stress at the time of lamination is removed in a short time. Thereby, the dimension change after peeling the PET sheet 2 away is stabilized, and a circuit board with high position accuracy and excellent productivity can be provided. <P>COPYRIGHT: (C)2012,JPO&INPIT |
