| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pin jack structure capable of reducing the thickness and the number of parts in an electronic device. <P>SOLUTION: A backlight shield 20, which a metallic board such as steel is processed in a desired shape, includes a shield section 21 and a jack ground section 22. The jack ground section 22 has a structure that a part of the shield section 21 is pressed to the desired cylindrical shape. The jack ground section 22 has a first to a third jack ground sections 22a to 22c. A first to a third colored insulation sections 30a to 30c with a first to a third signal pins 40a to 40c housed therein are housed in the cylindrical shapes of the first to the third jack ground sections 22a to 22c. <P>COPYRIGHT: (C)2012,JPO&INPIT |
