发明名称 RESIN COMPOSITION, INSULATING FILM USING THE SAME, AND ELECTRONIC COMPONENT
摘要 Provided is a photosensitive resin composition having excellence in photosensitive characteristics such as resolution and residual film ratio, in adhesion with the substrate the region exposed to a lower amount of light, in light resistance to UV light region, and in light transmittance at visible light region, and a photosensitive resin composition for an organic interlayer insulating film for a TFT-LCD requiring an etching process margin, an exposing process margin, and a light resistance.
申请公布号 WO2011139111(A1) 申请公布日期 2011.11.10
申请号 WO2011KR03376 申请日期 2011.05.06
申请人 ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.;KIM, TAE YOUNG;HAN, SEOK;KIM, SEUNG KEUN;JUNG, JU YOUNG;SUNG, IN KYUNG;LEE, MOO YOUNG;AN, SANG WANG;JANG, LAE SUN;LEE, HAG JU 发明人 KIM, TAE YOUNG;HAN, SEOK;KIM, SEUNG KEUN;JUNG, JU YOUNG;SUNG, IN KYUNG;LEE, MOO YOUNG;AN, SANG WANG;JANG, LAE SUN;LEE, HAG JU
分类号 C09D135/00;C03C1/00;C08F220/26;C08K5/3492;C09D7/12;G03F7/004 主分类号 C09D135/00
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