CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to arrange a protective dam in the boundary part of a semiconductor chip, thereby preventing the penetration of a molding material into an active area of the semiconductor chip. CONSTITUTION: A connection pad is arranged in one surface of a substrate. A semiconductor chip is mounted on the substrate and comprises an electrode pattern and a bump(220). The bump is separately arranged from an electrode pattern and bonded in the connection pad. A protective dam(230) is arranged in the boundary of one surface facing the substrate of the semiconductor chip in order to surround the electrode pattern and bump. A molding material(300) is arranged on the substrate in order to cover the semiconductor chip.