发明名称 BASE MATERIAL FOR FILLING AND FILLING METHOD EMPLOYING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a base material for filling of which the fusion temperature in filling is low and with which a high fusing point can be ensured after solidification and further work operability is improved, and a filling method employing the same. <P>SOLUTION: A base material 5 for filling has a structure in which a metal layer 2 including a first metal layer 21 and a second metal layer 22 is provided on one surface of a supporting substrate 1. The first metal layer 21 is obtained by aggregating nano metal particles which can be fused at a temperature lower than that of the first metal layer 21, and the second metal layer 22 is obtained by aggregating metal particles of which the fusing point is lower than that of the first metal layer 21. One surface side of the base material 5 for filling is stacked on one surface of a substrate 3 opening a fine space 30. The base material 5 for filling is then heated and pressurized F1 and the fine space 30 is filled with the fused metal layer 2. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011228571(A) 申请公布日期 2011.11.10
申请号 JP20100098664 申请日期 2010.04.22
申请人 NAPURA:KK 发明人 SEKINE SHIGENOBU;SEKINE YURINA;KUWANA RYOJI
分类号 H01L23/52;B32B15/01;H01L21/28;H01L21/288;H01L21/3205;H01L23/14;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L23/52
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