发明名称 DICING APPARATUS AND DICING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a dicing method and a dicing apparatus having compact constitution and capable of improving the operating efficiency. <P>SOLUTION: A workpiece supply waiting part 40 in which a workpiece W before working is stocked and a workpiece collection waiting part 50 which stocks a workpiece W after working are installed facing each other across a working part 30. The workpiece W before working is stocked in the workpiece supply waiting part 40 in such a manner that a surface attached with a dicing film T faces the side of a work table 20 in a vertically upright position. The workpiece W after working is stocked in the workpiece collection waiting part 50 in such a manner that the surface attached with the dicing film T faces the work table 20 side in a vertically upright position. The workpiece W stocked in the workpiece supply waiting part 40 is supplied to the work table 20 by a workpiece supply device 60. The workpiece W after working is collected from the work table 20 by a workpiece collection device 70 and transferred to the workpiece collection waiting part 50. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011228641(A) 申请公布日期 2011.11.10
申请号 JP20110032224 申请日期 2011.02.17
申请人 TOKYO SEIMITSU CO LTD 发明人 HIGASHI MASAYUKI;ARAI YUSUKE;FUJITA TAKASHI
分类号 H01L21/301 主分类号 H01L21/301
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