发明名称 RESIN COMPOSITION, MOLDED ARTICLE AND HOUSING FOR ELECTRIC/ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition that can provide a molded article superior in all the characteristics of moldability, flame resistance, impact strength and hygroscopicity. <P>SOLUTION: The resin composition contains: a cellulose ester (A); a thermoplastic resin (B) having an aromatic ring on the main chain; a low-molecular weight plasticizer (C1) formed from a compound with a molecular weight of 450 or less; an oligomer plasticizer (C2) formed from a compound with a mass average molecular weight of 500 to 5,000; and a phosphorus-based flame retardant (D) formed from a phosphorus-containing compound with a molecular weight of 400 to 800. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011225845(A) 申请公布日期 2011.11.10
申请号 JP20110072363 申请日期 2011.03.29
申请人 FUJIFILM CORP 发明人 NAGAI TAKAYASU;SAWAI DAISUKE;NORO MASAKI;INADA HIROSHI
分类号 C08L1/08;C08K5/521;C08L27/12;C08L69/00;C08L101/00 主分类号 C08L1/08
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