| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing a semiconductor wafer, which has high storage stability under various kinds of environments; capability of preventing an adherend from contamination even after use; and excellent followability to a level difference formed by a circuit pattern and also great stability of a floating amount over time when attached on a surface where the circuit pattern of the semiconductor wafer is formed. <P>SOLUTION: The adhesive sheet for processing a semiconductor wafer includes an adhesive layer on at least one side of a substrate, where a polyester based plasticizer and a surfactant are added to a base polymer of the adhesive layer and the solubility parameters (SP values) of the plasticizer and the surfactant satisfy the relation of 0.9≥[SP value of the plasticizer]/[SP value of the surfactant]≥1.0. <P>COPYRIGHT: (C)2012,JPO&INPIT |
