| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC module and an IC card in which a pad electrode of an IC chip and a bonding wire are not formed on a position where the largest load is applied to the IC module. <P>SOLUTION: The IC module is configured so that a plurality of external terminals composed of respectively independent metal thin plates are formed on a surface of a non-conductive substrate through adhesive, apertures for exposing the rear faces of respective external terminals through the substrate are formed on a rear face of the substrate, and the IC chip is fixed on the rear face of the substrate through adhesive. When the IC chip is mounted so that a center part of the IC chip is superposed to a center part of the substrate, the pad electrode formed on the exposed surface of the IC chip is formed so as not to be located on the inside of a virtual band of 1 to 2 mm formed on the vertical/horizontal center part of the IC chip, and the bonding wire for connecting the pad electrode of the IC chip to the rear face of the external terminal which is exposed to the rear side of the substrate is connected so as not to cross the virtual band. <P>COPYRIGHT: (C)2012,JPO&INPIT |
