| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus having a multilayer wiring substrate, capable of extracting signal wiring and power wiring with a small number of wiring layers, without deteriorating junction intensity between an electronic component and the multilayer wiring substrate. <P>SOLUTION: The electronic apparatus includes a multilayer wiring substrate 110 and an electronic component 100 disposed on the multilayer wiring substrate 110. A first wiring layer of the multilayer wiring substrate 110 facing the electronic apparatus includes a first signal pad, connected to a signal terminal, and a first power pad connected to a power terminal. On the first wiring layer, a conductive pad disposed in a two-dimensional shape, first signal wiring, and first power wiring that has a thickness greater than the first signal wiring are formed. On the second wiring layer, a second signal pad, a second power pad, second signal wiring, and second power wiring that has a thickness greater than the second signal wiring are formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
