| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure for interconnecting CZT and/or CdTe to an interposer that offers low local strain and that can accommodate conventional attachment methods available today to manufacturers. <P>SOLUTION: A micro pin hybrid interconnect array (10) includes a crystal anode array (18) and a ceramic substrate (14). The array (18) and substrate (14) are joined together using an interconnect (12) geometry having a large aspect ratio of height to width. The joint affixing the interconnect (12) to the crystal anode array (18) is devoid of solder. <P>COPYRIGHT: (C)2012,JPO&INPIT |
