发明名称 MATERIAL FOR FORMING PROTECTIVE FILM AND FORMING METHOD FOR RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a material for forming a protective film which is capable of improving water repellency while suppressing a deterioration in alkali solubility of the protective film, and to provide a forming method for a resist pattern using the material for forming a protective film. <P>SOLUTION: A material for forming a protective film contains an alkali-soluble polymer having a structural unit derived from a monomer represented by formula (A-1). In the formula, R<SP POS="POST">0</SP>represents a group expressed by formula (a-1) or formula (a-2), Q<SP POS="POST">0</SP>represents a divalent linkage group which may have a single bond or a fluorine atom, and R<SP POS="POST">1</SP>represents an organic group which may have a fluorine atom. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011227290(A) 申请公布日期 2011.11.10
申请号 JP20100096930 申请日期 2010.04.20
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHIRAI YURIKO;YOSHIDA MASAAKI;NAMIKI TAKUMI;ISHIKAWA KIYOSHI;KOSHIYAMA ATSUSHI
分类号 G03F7/11;C08F20/10;C08F32/00;G03F7/38;H01L21/027 主分类号 G03F7/11
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