| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing device that can suppress occurrence of thermal breaking of a conductor. <P>SOLUTION: A plasma processing device has a sealable chamber in which reactive gas is introduced, a discharging unit that has a cathode electrode and an anode electrode disposed so as to face each other in the chamber and generates plasma discharge between the cathode electrode and the anode electrode, a power source for supplying power to the cathode electrode, a conductor for electrically connecting the power source and the cathode electrode, and an air cooling means for cooling the conductor. <P>COPYRIGHT: (C)2012,JPO&INPIT |
