| 摘要 |
<p>The invention relates to a microelectronic device (100) comprising: a plurality of similar disconnected semiconductor portions (104) electrically insulated from each other and forming a semiconductor layer (102), wherein said portions are spaced apart at a constant distance and comprise a shape which is parallel to the other portions; and two electrodes (108a, 108b, 108c, 108d) arranged in contact with the semiconductor layer such that a maximum distance separating the two electrodes is less than a largest dimension of one of the semiconductor portions, wherein the shape and size of the semiconductor portions, the spacing between the semiconductor portions, the shape and size of the electrodes as well as the arrangement of the electrodes relative to the semiconductor portions are such that at least one of the semiconductor portions electrically connects the two electrodes to one another, and wherein the largest dimensions of the semiconductor portions are perpendicular to a largest dimension of the electrodes, the electrodes being similar.</p> |
