COMPOSITE METAL LAYER WITH SUPPORT METAL FOIL, WIRING BOARD USING THE SAME AND METHOD FOR MANUFACTURING THE SAME, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a composite metal layer with a support metal foil which reduces wastes to be generated by manufacture of a wiring board and is favorable for the global environment, the wiring board using the same and a method for manufacturing the same, and a method for manufacturing a semiconductor package using the wiring board.

SOLUTION: There is provided the composite metal layer with the support metal foil which is constituted by laminating a plurality of metal layers consisting of the bottom layer metal layer which is the support metal foil and two or more layers of metal layers while putting a peeling layer between the adjacent metal layers, in which peeling strength between each metal layer A which is located between the bottom layer metal layer and the top layer metal layer and a metal layer B adjacent to the metal layer A via a peeling layer on its top face is smaller than peeling strength between the metal layer A and a metal layer C adjacent to the metal layer A via a peeling layer on its bottom face, the wiring board using the same and the method for manufacturing the same, the method for manufacturing the semiconductor package using the wiring board.

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