| 摘要 |
<p>PURPOSE: An optical package and a manufacturing method thereof are provided to reduce the volume and thickness of a package by forming the package of a lead frame mode into a package which uses a tape substrate. CONSTITUTION: An insulating layer(110) is formed on a metal layer(120) and includes holes. A white reflecting layer(130) is formed to fill the side of the insulating layer on the surface of the insulating layer. The white reflecting layer is also formed by printing one of a silver paste, a white solder resist, or a white epoxy. A connection unit(160) electrically interlinks an optical device(150) and a circuit pattern. A resin unit(170) fills the optical device and the connection unit.</p> |
