| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing light emitting diode chips having high heat radiating performance and a manufacturing method for a substrate of the same. <P>SOLUTION: A manufacturing method for a package for housing light emitting diode chips to provide one electrode plate equipped with a plurality of electrode units and at least one insulating substrate comprises: a step of providing each electrode unit with a first electrode and a second electrode; a step of hot pressure-joining the electrode plate and the at least one insulating substrate to cover the plurality of first electrodes and the plurality of second electrodes with the insulating substrate; a step of grinding the insulating substrate on the surface of the electrode plate to expose the first electrode and the second electrode to form a substrate layer; a step of pasting together a plurality of light emitting diode chips over the substrate layer to electrically connect the first electrode and the second electrode matching each light emitting diode chip; and a step of cutting the substrate layer to form the plurality of package for housing light emitting diode chips. <P>COPYRIGHT: (C)2012,JPO&INPIT |
