| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element manufacturing method, a light emitting element package and an illumination system. <P>SOLUTION: A light emitting element comprises a conductive supporting substrate, an ohmic contact layer and a current intercepting layer over the conductive supporting substrate, a light emitting structure layer over the ohmic contact layer and the current intercepting layer, an electrode of which at least a part overlaps with the current intercepting layer over the light emitting structure layer, a current intercepting layer, and a first current guide layer of which at least a part overlaps the current intercepting layer between the current intercepting layer and the conductive supporting substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
