| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition which has high wettability; therefore when used to connect members to be connected, hardly generates voids after connection, and to provide a connected structure using the curable composition. <P>SOLUTION: The curable composition contains a thermosetting compound, a heat curing agent, and a polyether-modified siloxane. The connected structure 1 includes a first member 2 to be connected, a second member 4 to be connected, and a connecting part 3 which connects the first and the second members 2, 4 to be connected. The connecting part 3 is formed from the curable composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
