WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wafer level package and a method of manufacturing the same.

SOLUTION: There is provided a wafer level package comprising a first substrate 110 including a first region 110a and second regions 110b with grooves 114 around the first region 110a; a semiconductor device 115 positioned in the first region 110a; first sealing members 130 positioned in the grooves 114; a second substrate 120 including projection units 121 corresponding to the second regions 110b in order to form a cavity 122 corresponding to the first region 110a; and second sealing members 14 which are positioned above the projection units 121 and laminate the first and second substrates 110 and 120 to each other by being bonded to the first sealing members 130, and can prevent the sealing members from flowing to any region except for the sealing regions.

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