| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve, for use in probe testing of semiconductor devices, a reduction of the number of probe needles to the necessary minimum and power supply margins for the semiconductor devices. <P>SOLUTION: There are provided mutually adjoining first power pad electrode 21 and second power pad electrode 22 that supply power to an internal circuit and mutually adjoining first grounding pad electrode 23 and second grounding pad electrode 24 that supply grounding to the internal circuit, wherein, one power pad electrode out of the first and second power pad electrodes is connected by a probe needle 4, one grounding pad electrode out of the first and second grounding pad electrodes is connected by a probe needle 4, the first power pad electrode and the second power pad electrode are connected by metal wiring 10, and similarly the first grounding pad electrode and the second grounding pad electrode are connected by metal wiring 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
