发明名称 |
LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS |
摘要 |
[PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material. [MEANS FOR SOLVING] 0.1 to 1.5% by weight of Cu, 0.01% by weight or more and less than 0.05% by weight of Co, 0.05 to 0.25% by weight of Ag, 0.001 to 0.008% by weight of Ge, and the remainder being Sn. This low silver lead-free solder alloy is blended with a pasty flux or molded in a liner form by using a solid or pasty flux as a core. [SELECTED FIGURE] FIG. 2
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申请公布号 |
US2011274937(A1) |
申请公布日期 |
2011.11.10 |
申请号 |
US201013145163 |
申请日期 |
2010.01.18 |
申请人 |
KOKI COMPANY LIMITED;KABUSHIKI KAISHA NIPPON FILLER METALS |
发明人 |
SUGIMORI KENICHIRO;YAMADA SEIJI;KAWAKUBO SATOSHI;IRISAWA ATSUSHI |
分类号 |
B32B15/04;B23K35/34;C22C13/00 |
主分类号 |
B32B15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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