WAFER LEVEL CAMERA MODULE WITH ACTIVE OPTICAL ELEMENT

摘要

A wafer level camera module may be easily connected to a host device via mounting surface contacts. The module includes an electrically controllable active optical element and a flexible printed circuit that provides electrical connection between the optical element and surface conductors on a mounting surface of the module. The surface conductors may be a group of solder balls, and the module may have another group of solder balls that make connection to another electrical component of the module, such as an image sensor. All of the solder balls may be coplanar in a predetermined grid pattern, and all of the components of the device may be surrounded by a housing such that the camera module is an easily mounted ball grid array type package.