THERMALLY CONDUCTIVE INSULATING RESIN MOLDING

摘要

PROBLEM TO BE SOLVED: To provide a highly heat-dissipating insulating resin material.

SOLUTION: Core/shell particles (3) comprise core particles (2) that contain a polymer compound, and a shell (1) that contains a thermally conductive and insulating inorganic compound. An insulating resin molding (4) formed by pressurizing and/or heating an aggregate of the core/shell particles (3) has the excellent heat dissipation because having a continuous heat conduction path (5) internally.

COPYRIGHT: (C)2012,JPO&INPIT