| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser processing method that removes an adhesive in the vicinity of a terminal portion, prevents an oxide film from being generated at the terminal portion due to a laser radiation, and improves a wettability as well as a conductivity on a surface of the terminal in order to addresses a problem in an exposure processing using laser beam for the terminals in an IC chip circuit or an antenna circuit embedded in a card substrate. <P>SOLUTION: In a contact/non-contact dual interface-type IC card comprising an external connection terminal plate, an antenna circuit and an IC chip on a card substrate, a CO<SB POS="POST">2</SB>laser and a YAG laser are used in sequence for conducting an exposure processing of a connection terminal of the IC chip or the connection terminal of the antenna circuit to connect the external connection terminal plate and the IC chip embedded in a card substrate or to connect the IC chip attached with the external connection terminal plate and the antenna circuit embedded in the card substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
