发明名称 METHOD FOR FORMING A TITANIUM-CONTAINING LAYER ON A SUBSTRATE USING AN ATOMIC LAYER DEPOSITION (ALD) PROCESS
摘要 A method for forming a titanium-containing layer on a substrate, the method comprising at least the steps of: a) providing a vapor comprising at least one precursor compound of the formula Ti(Me5Cp)(OR)3 (I), wherein R is selected in the group consisting in methyl, ethyl, isopropyl; or of the formula Ti(R1Cp)(OR2)3 (II), wherein R1 is selected from the group consisting in H, methyl, ethyl, isopropyl and R2 is independently selected from the group consisting in methyl, ethyl, isopropyl or tert-butyl; b) reacting the vapor comprising the at least one compound of formula (I) or (II) with the substrate, according to an atomic layer deposition process, to form a layer of a tantalum-containing complex on at least one surface of said substrate.
申请公布号 US2011275215(A1) 申请公布日期 2011.11.10
申请号 US20090920026 申请日期 2009.02.13
申请人 GATINEAU SATOKO;DUSSARRAT CHRISTIAN;LACHAUD CHRISTOPHE;BLASCO NICOLAS;PINCHART AUDREY;WANG ZIYUN;GIRARD JEAN-MARC;ZAUNER ANDREAS 发明人 GATINEAU SATOKO;DUSSARRAT CHRISTIAN;LACHAUD CHRISTOPHE;BLASCO NICOLAS;PINCHART AUDREY;WANG ZIYUN;GIRARD JEAN-MARC;ZAUNER ANDREAS
分类号 H01L21/3205 主分类号 H01L21/3205
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