发明名称 |
SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS USING MULTIPLE SOLDER WIRES |
摘要 |
An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.
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申请公布号 |
US2011272452(A1) |
申请公布日期 |
2011.11.10 |
申请号 |
US20100773099 |
申请日期 |
2010.05.04 |
申请人 |
LAM KUI KAM;TU PINGLIANG;IP CHUN HUNG SAMUEL |
发明人 |
LAM KUI KAM;TU PINGLIANG;IP CHUN HUNG SAMUEL |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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