| 摘要 |
The present disclosure relates to heat dissipation apparatus that may be used within a downhole tool. The heat dissipation apparatus may include one or more of a cover configured to attach to a heat generating device, a thermal conduit thermally coupled to the cover, and a heat sink thermally coupled to the thermal conduit, in which the heat sink is configured to dissipate heat from the heat generating device through the cover and the thermal conduit.
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