摘要 |
<P>PROBLEM TO BE SOLVED: To achieve more accurate measurement of the characteristics of an electronic device (and semiconductor elements 2a and 2b forming the device) constituted by arranging multiple semiconductor elements 2a and 2b in close to each other in the vertical direction than before the combination is used. <P>SOLUTION: Using a semiconductor element connecting socket 24 which connects mutually corresponding electrodes 8 and 10 of a first and a second semiconductor elements 2a and 2b, both sides of the socket 24 receive the semiconductor elements 2a and 2b, mutually corresponding ones of electrodes 8 and 10 of semiconductor elements 2a and 2b are electrically connected to measure electrical characteristics of an electronic device comprising the semiconductor elements 2a and 2b. As the semiconductor element connecting socket, a wiring board having a wiring which electrically leads out a connection point, where electrodes 8 and 10 of semiconductor elements 2a and 2b are connected, to the outside, may be used. <P>COPYRIGHT: (C)2012,JPO&INPIT |