发明名称 MEASURING METHOD OF ELECTRICAL CHARACTERISTICS, MEASURING DEVICE OF ELECTRICAL CHARACTERISTICS USED THEREFOR AND SEMICONDUCTOR ELEMENT CONNECTING SOCKET FORMING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To achieve more accurate measurement of the characteristics of an electronic device (and semiconductor elements 2a and 2b forming the device) constituted by arranging multiple semiconductor elements 2a and 2b in close to each other in the vertical direction than before the combination is used. <P>SOLUTION: Using a semiconductor element connecting socket 24 which connects mutually corresponding electrodes 8 and 10 of a first and a second semiconductor elements 2a and 2b, both sides of the socket 24 receive the semiconductor elements 2a and 2b, mutually corresponding ones of electrodes 8 and 10 of semiconductor elements 2a and 2b are electrically connected to measure electrical characteristics of an electronic device comprising the semiconductor elements 2a and 2b. As the semiconductor element connecting socket, a wiring board having a wiring which electrically leads out a connection point, where electrodes 8 and 10 of semiconductor elements 2a and 2b are connected, to the outside, may be used. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011226996(A) 申请公布日期 2011.11.10
申请号 JP20100098999 申请日期 2010.04.22
申请人 TOYO ELECTRONICS ENG CO LTD 发明人
分类号 G01R31/26;G01R1/073 主分类号 G01R31/26
代理机构 代理人
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