发明名称 |
MANUFACTURING METHOD FOR RECYCLED PHOTOMASK SUBSTRATE, MANUFACTURING METHOD FOR RECYCLED PHOTOMASK BLANK, RECYCLED PHOTOMASK AND MANUFACTURING METHOD FOR THE SAME, AND PATTERN TRANSFER METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a manufacturing cost while securing a quality standard for a photomask substrate when manufacturing a recycled photomask substrate using a used photomask. <P>SOLUTION: A method for producing a substrate for a recycled photomask using a used photomask comprising a transparent substrate with a film pattern formed on a first main surface thereof comprises a step of removing the film pattern from the first main surface, and a polishing step of polishing the first main surface and a second main surface, respectively. In the polishing step, the polishing is performed with such a polishing amount that flaw defect of 300 μm or larger in size does not remain but flaw defect of 2 μm or larger and smaller than 300 μm in size remains outside transfer areas of the first main surface and second main surface and that flaw defect of 100 μm or larger in size does not remain within the transfer area of the second main surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011227260(A) |
申请公布日期 |
2011.11.10 |
申请号 |
JP20100096322 |
申请日期 |
2010.04.19 |
申请人 |
HOYA CORP |
发明人 |
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分类号 |
C03C19/00;G03F1/50;G03F1/60 |
主分类号 |
C03C19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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