发明名称 MANUFACTURING METHOD FOR RECYCLED PHOTOMASK SUBSTRATE, MANUFACTURING METHOD FOR RECYCLED PHOTOMASK BLANK, RECYCLED PHOTOMASK AND MANUFACTURING METHOD FOR THE SAME, AND PATTERN TRANSFER METHOD
摘要 <P>PROBLEM TO BE SOLVED: To reduce a manufacturing cost while securing a quality standard for a photomask substrate when manufacturing a recycled photomask substrate using a used photomask. <P>SOLUTION: A method for producing a substrate for a recycled photomask using a used photomask comprising a transparent substrate with a film pattern formed on a first main surface thereof comprises a step of removing the film pattern from the first main surface, and a polishing step of polishing the first main surface and a second main surface, respectively. In the polishing step, the polishing is performed with such a polishing amount that flaw defect of 300 &mu;m or larger in size does not remain but flaw defect of 2 &mu;m or larger and smaller than 300 &mu;m in size remains outside transfer areas of the first main surface and second main surface and that flaw defect of 100 &mu;m or larger in size does not remain within the transfer area of the second main surface. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011227260(A) 申请公布日期 2011.11.10
申请号 JP20100096322 申请日期 2010.04.19
申请人 HOYA CORP 发明人
分类号 C03C19/00;G03F1/50;G03F1/60 主分类号 C03C19/00
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