发明名称 Thermoelectric modules
摘要 A thermoelectric module includes: thermoelectric semiconductor elements; printed metal conductors for interconnecting the semiconductor elements; and at least one base support for the printed conductors, the base support including a metal matrix composite.
申请公布号 US2011271995(A1) 申请公布日期 2011.11.10
申请号 US201113066985 申请日期 2011.04.29
申请人 WETZL FRANZ;RITTNER MARTIN;LEONHARDT MATTHIAS;WINKELMANN ANTJE 发明人 WETZL FRANZ;RITTNER MARTIN;LEONHARDT MATTHIAS;WINKELMANN ANTJE
分类号 H01L35/32;H01L35/34 主分类号 H01L35/32
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