METHOD FOR PRODUCING A MICTOSTRUCTURE ON A CARRIER

摘要

The present invention relates to a method for producing a microstructure (40, 41) on a carrier (45, 46), comprising the following steps: (a) producing a donor film (20) by forming an embossing structure having elevations and depressions in a first film material (21) and applying a transfer layer (30, 31, 32) to the embossing structure, (b) producing an acceptor film (50) by applying an adhesive layer (53, 54, 55) to a second film material (51), (c) laminating the donor film (20) and the acceptor film (50) by means of the adhesive layer (53, 54, 55), wherein the transfer layer adhesively bonds on the elevations of the embossing structure by means of the adhesive layer (53, 54, 55) and (d) transferring the adhesively bonded regions of the transfer layer (30, 31, 32) onto the acceptor film (50) by separating the donor film (20) and the acceptor film (50) from one another, as a result of which, in the acceptor film (50), a first microstructure (40) is formed from the transferred regions of the transfer layer, and/or a second microstructure (41) complementary to the first microstructure (40) is formed in the donor film (20). The invention additionally relates to the use of the microstructure carriers obtainable according to the method as part of a security element (5), and also to security elements (5) comprising a microstructure carrier obtainable according to the method according to the invention, and products (1) protected by the security element (5).