| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an elastic-wave device, which is reduced in the number of manufacturing steps, and has a bump electrode identical with a seal ring in height. <P>SOLUTION: A method of manufacturing an elastic-wave device includes the steps of: forming an elastic-wave element 12 on a first substrate 10; concurrently forming a bump electrode 30 electrically connected to the elastic-wave element 12, and an annular seal ring 32 surrounding the bump electrode 30 on the first substrate 10 by plating; and joining the bump electrode 30 and the annular seal ring 32 surrounding the bump electrode 30 to a pad electrode 64 and an annular seal ring 62 which are both on a mount board 60. <P>COPYRIGHT: (C)2012,JPO&INPIT |
