发明名称 PHOTOSENSITIVE RESIN COMPOSITION, FORMING METHOD OF SILICA BASED COATING USING THE SAME, AND DEVICE AND MEMBER HAVING SILICA BASED COATING
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which facilitates forming of silica based coating as an interlayer insulating film, is excellent in storage stability, is comparatively inexpensive, and is excellent in heat resistance, crack resistance, resolution, and transparency, to provide a forming method of the silica based coating using the photosensitive resin composition, and to provide a semiconductor device, a flat panel display and an electronic device member comprising the silica based coating. <P>SOLUTION: A photosensitive resin composition comprises: a siloxane resin having a weight average molecular weight of 8000 to 300000 obtained through hydrolysis-condensation after mixing a first siloxane resin which is obtained by hydrolyzing and condensing a first silane compound containing a compound represented by general formula (1) and a second siloxane resin obtained by hydrolyzing and condensing a second silane compound containing a compound represented by general formula (2); a solvent; and a naphthoquinonediazidosulfonic ester. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011227159(A) 申请公布日期 2011.11.10
申请号 JP20100094533 申请日期 2010.04.16
申请人 HITACHI CHEM CO LTD 发明人 INOUE KEISUKE;ABE KOICHI;MATSUMOTO KATSURA
分类号 G03F7/075;C08G77/44;G03F7/004;G03F7/022;G03F7/40 主分类号 G03F7/075
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