| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad capable of detecting optically an end point at high accuracy during polishing, and preventing slurry from leaking from a polishing layer toward a cushion layer, and to provide a method for manufacturing a semiconductor device using the polishing pad. <P>SOLUTION: In the polishing pad, polishing layers having a polishing area and a light transmission area, and cushion layers having through holes are laminated via a double-sided adhesive sheet so that the light transmission area is overlaid on the through holes. A light-transmitting member is adhered to an adhesive layer of the double-sided adhesive sheet in the through holes. <P>COPYRIGHT: (C)2012,JPO&INPIT |
