发明名称 Non-Fibrous high modulus ultra high molecular weight polyethylene tape for ballistic applications
摘要 A non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.
申请公布号 US2011274904(A1) 申请公布日期 2011.11.10
申请号 US201113135536 申请日期 2011.07.08
申请人 WEEDON GENE C;HARDING KENNETH C;OWEN LISA 发明人 WEEDON GENE C.;HARDING KENNETH C.;OWEN LISA
分类号 B32B3/00 主分类号 B32B3/00
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