发明名称 |
CONTACT SPRINGS FOR SILICON CHIP PACKAGES |
摘要 |
A method for manufacturing a silicon chip package for a circuit board assembly is provided with a package substrate having a silicon chip and an array of contact pads provided by conductive material. A plurality of conductive springs are affixed to the array of contact pads for providing conductive contact with the corresponding array of contacts on a circuit board assembly.
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申请公布号 |
US2011273857(A1) |
申请公布日期 |
2011.11.10 |
申请号 |
US20100776027 |
申请日期 |
2010.05.07 |
申请人 |
ORACLE INTERNATIONAL CORPORATION |
发明人 |
BET-SHLIEMOUN ASHUR S. |
分类号 |
H05K1/18;H01L21/00;H01L23/48;H05K3/30;H05K3/34 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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