发明名称 |
ARC DISCHARGE DEVICE |
摘要 |
[Object] To incorporate more semiconductor elements in a small-sized lightweight power semiconductor module provided in an arc discharge device. [Means for Settlement] A power supply unit of an arc discharge device includes a semiconductor module 1, and a radiator fitted onto the semiconductor module 1. The semiconductor module 1 includes a module casing 2, and common units 3a to 3c retained by the module casing 2. Each of the common units 3a to 3c has: a ceramic substrate 50 having a circuit surface disposed with a semiconductor element 54, and a radiation surface on a side opposite to the circuit surface; and a package 35 that exposes the radiation surface, and seals the circuit surface with heat resistant resin. The radiator is fitted onto the module casing 2 to be thereby brought into abutting contact with all of the radiation surfaces of the common units 3a to 3c. Based on such a configuration, more semiconductor elements can be incorporated in a small-sized lightweight power semiconductor module. |
申请公布号 |
EP2149902(A4) |
申请公布日期 |
2011.11.09 |
申请号 |
EP20070743686 |
申请日期 |
2007.05.18 |
申请人 |
SANSHA ELECTRIC MANUFACTURING COMPANY, LIMITED |
发明人 |
SODA, OSAMU;OHNISHI, YUJI;INAMI, KAZUNORI;UCHIDA, TOSHIO |
分类号 |
H01L25/07;H01L25/11;H01L25/18;H05K7/20 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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