| 摘要 |
<p>The method of producing hole (10) by a laser, comprises producing an intermediate hole (10') with significantly smaller diameter in comparison with a hole to be produced, and producing a final diameter of the hole to be produced. The intermediate hole represents a blind hole and a clearance hole having the smaller diameter of 95% of the depth of the hole to be produced, where a transition-clearance hole is produced from the blind hole by a production parameter, which is different from the production parameter for the intermediate hole, and the diameter of the intermediate hole is not changed. The method of producing hole (10) by a laser, comprises producing an intermediate hole (10') with significantly smaller diameter in comparison with a hole to be produced, and producing a final diameter of the hole to be produced. The intermediate hole represents a blind hole and a clearance hole having the smaller diameter of 95% of the depth of the hole to be produced, where a transition-clearance hole is produced from the blind hole by a production parameter, which is different from the production parameter for the intermediate hole, and the diameter of the intermediate hole is not changed. The transition-clearance hole is produced 20% of energy than the production of intermediate hole, and is prepolished/processed by a trepanning-process to reach a final diameter of the hole. The final diameter of the intermediate hole is 40-60%, which is 10% smaller than the diameter of the produced hole.</p> |
