发明名称 HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET
摘要 An object is to provide a heat conductive adhesive composition containing boron nitride particles and an acrylic polymer, which is capable of forming a molding having a good heat conductivity, and a heat conductive adhesive sheet with the heat conductive adhesive composition therein, which has a good heat conductivity and bond strength. Provided is the heat conductive adhesive composition which contains boron nitride particles and an acrylic polymer component, and the above boron nitride particles contain boron nitride particles having a particle size of 3 µm or more and 300 µm or less, wherein the boron nitride particles contain 5 to 45% by volume of boron nitride particles having a particle size of 3 µm or more and 20 µm or less, 30 to 70% by volume of boron nitride particles having a particle size of more than 20 µm and 60 µm or less, 10 to 40% by volume of boron nitride particles having a particle size of more than 60 µm and 300 µm or less.
申请公布号 KR20110122144(A) 申请公布日期 2011.11.09
申请号 KR20117020048 申请日期 2010.01.13
申请人 NITTO DENKO CORPORATION 发明人 NAKAYAMA JUNICHI;TERADA YOSHIO;FURUTA KENJI;WANO TAKASHI
分类号 C09J133/00;C09J7/00;C09J9/00;C09J11/04 主分类号 C09J133/00
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