METHOD AND DEVICE FOR FORMING A PACKET-LIKE BACK-TO-BACK WAFER BATCH

摘要

Method and device for forming a packet-like back-to-back wafer batch made up of a predetermined even number of wafers that are to be doped on one side. The wafers of one half of the batch are horizontally and congruously arranged on supporting surfaces of a support system which are disposed at a vertical distance from each other. Holding elements of a holding system have a horizontal upper holding surface and a horizontal lower surface and are provided so as to be movable back and forth relative to two adjacent supporting surfaces between a releasing position and a holding position. The wafers of the second half of the batch, which have previously been moved into a position that is offset by 180° relative to the position of the wafers of the first half are inserted into a holding system so each wafer of the second half rests on the horizontal upper holding surface. Each holding element is simultaneously moved outward in the horizontal direction relative to the adjacent supporting surfaces until the horizontal upper holding surface is in the releasing position and the wafer of the second half rests on the wafer of the first half in a suspended manner on the formed air cushion. Each holding element is moved inward in the horizontal direction into the holding position, in which the horizontal lower surface of the holding element fixes the two wafers.