| 摘要 |
PROBLEM TO BE SOLVED: To provide a three dimensional circuit board in which connection reliability against heat distortion is improved and deformation of the substrate is suppressed by suppressing expansion/contraction due to temperature of the substrate, and bare chip mountability is improved and heat radiation characteristics is raised by raising heat conductivity at the mounting part of an electronic element. SOLUTION: In the three dimensional circuit board 1, a wiring pattern 4 is formed on a resin molding 2, and an electronic element such as IC5 is mounted on the surface of resin molding 2. The resin molding 2 is formed on the surface of an insert member 3 which is formed with the material whose linear expansion coefficient is smaller than the resin molding 2. The heat conductivity of the insert member 3 is higher than that of the resin molding 4. COPYRIGHT: (C)2006,JPO&NCIPI |
