发明名称 Pressure-sensitive adhesive tape
摘要 <p>A pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer as a pressure-sensitive adhesive containing a pressure-sensitive adhesive composition, a bubble, and a hollow inorganic fine particle. The hollow inorganic fine particle contains at least sodium and silicon, and the mass ratio of the sodium and the silicon that are contained in the hollow inorganic fine particle (Na/Si) is 0.5 or less. Thereby, the size of the pinhole and the number of the pinholes in the pressure-sensitive adhesive tape can be suppressed, the pinhole having a structure in which, when light is radiated onto one surface of the pressure-sensitive adhesive layer that is in the state of not being laminated on a substrate, the transmission amount of the light on the other surface thereof exceeds a predetermined threshold value, as a result of the presence of a bubble having a predetermined size or more in the pressure-sensitive adhesive layer.</p>
申请公布号 EP2385088(A1) 申请公布日期 2011.11.09
申请号 EP20110157683 申请日期 2011.03.10
申请人 NITTO DENKO CORPORATION 发明人 OGAWA, TAKUMA;TSUBAKI, HIROYUKI;INOKUCHI, SHINJI;KOSAKA, TOKUHISA;HIROSE, TETSUYA
分类号 C09J7/02;C09J11/04 主分类号 C09J7/02
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