| 摘要 |
PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to maintain air tightness and exciting by a molding part, thereby improving reliability. CONSTITUTION: A nitride semiconductor is arranged on a ceramic substrate and comprises a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. A first electrode(130) is arranged by penetrating the ceramic substrate and connected to the second conductive semiconductor layer. A second electrode(140) is connected to the first conductive semiconductor layer and ceramic substrate. A molding part(150) surrounds the nitride semiconductor and second electrode. The molding part is made of glass with a thermal expansion ratio of 90 to 110 percent with respect to the ceramic substrate. |
