发明名称
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a conductor film connection structure capable of simply forming connection of a second conductor film to be connected to a first conductor film. SOLUTION: This manufacturing method of a conductor film connection structure is used for manufacturing a connection structure between the first conductor film and the second conductor film formed on a substrate included in a display panel, and includes processes of: forming the first conductor film on the substrate; forming an intermediate conductor film on the first conductor film; and forming the second conductor film on the intermediate conductor film and delimiting overlapping parts of the first conductor film and the second conductor film, and a connection part of the intermediate conductor film sandwiched between the overlapping parts. The intermediate conductor film is formed of a first material having an electric resistance value higher than a higher electric resistance value within an electric resistance value of the first conductor film and that of the second conductor film. The manufacturing method includes a resistance lowering process of lowering the electric resistance value of the connection part of the intermediate conductor film relative to that of the first material. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP4812573(B2) 申请公布日期 2011.11.09
申请号 JP20060249169 申请日期 2006.09.14
申请人 发明人
分类号 H05B33/26;G09F9/30;H01L27/32;H01L51/50;H05B33/10 主分类号 H05B33/26
代理机构 代理人
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