发明名称 Method for determining the position of obstructed holes, device and machining device
摘要 <p>The method for determining a reference position of a partially closed hole of components (120, 130) such as cooling air holes (13', 13'', 13''') to be coated, comprises firmly and completely attaching three pins (4', 4'', 4''') in the component into a cooling air series (14', 14'' ,14'''), and performing a measurement of a reference position of the pins with respect to the components. The position of the pins or a distance of the two pins are placed in relation to the position of the hole and longitudinal axis of the hole. The method for determining a reference position of a partially closed hole of components (120, 130) such as cooling air holes (13', 13'', 13''') to be coated, comprises firmly and completely attaching three pins (4', 4'', 4''') in the component into a cooling air series (14', 14'' ,14'''), and performing a measurement of a reference position of the pins with respect to the components. The position of the pins or a distance of the two pins are placed in relation to the position of the hole and longitudinal axis of the hole or the holes before coating to use as reference followed by measuring the position of the pins after the coating of the component so that the position and the longitudinal axis of the closed hole are partially determined by which a record is generated for processing the hole after the coating the hole. The pin is introduced at a beginning and an end of the cooling air series, is introduced in a middle hole of the cooling air series, and comprises a protective cap (7', 7'', 7''') that is introduced before and after the coating of the component and removed before re-measuring. The position is partially or completely determined by the closed holes. The pin is formed in a cylindrical manner, and is introduced into the same cooling air series. The cooling air series are provided with the respective pins. Independent claims are included for: (1) a method for recovery of holes; (2) a measuring device for a component; and (3) a processing device.</p>
申请公布号 EP2385214(A1) 申请公布日期 2011.11.09
申请号 EP20100004821 申请日期 2010.05.06
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 MELZER-JOKISCH, TORSTEN;THOMAIDIS, DIMITRIOS, DR.
分类号 F01D5/00;C23C4/00;F01D5/18;F01D5/28 主分类号 F01D5/00
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