发明名称 |
Method and mask assembly for forming solder bodies on a substrate |
摘要 |
A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole with a first solder paste so as to form a first solder body on the substrate; positioning a second mask plate, which is formed with at least one second through-hole and at least one recess spaced apart from the second through-hole, on the substrate in such a manner that the first solder body is received in the recess; and filling the second through-hole with a second solder paste so as to form a second solder body on the substrate.
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申请公布号 |
US8052035(B2) |
申请公布日期 |
2011.11.08 |
申请号 |
US20070898245 |
申请日期 |
2007.09.10 |
申请人 |
UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.;UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD. |
发明人 |
CHENG CHI-HSIUNG;CHAN WAN-CHEN;LI HSUN-FA |
分类号 |
B23K31/00 |
主分类号 |
B23K31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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