发明名称 |
Standing chip scale package |
摘要 |
A standing chip scale package is disclosed. The standing chip scale package provides electrical connection to bumped device contacts on both sides of the chip. The package is coupleable to a printed circuit board in a standing configuration such that front and back sides of the bumped chip are substantially perpendicular to a mounting surface. A process of fabricating the standing chip scale package is also disclosed.
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申请公布号 |
US8053891(B2) |
申请公布日期 |
2011.11.08 |
申请号 |
US20080217136 |
申请日期 |
2008.06.30 |
申请人 |
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED |
发明人 |
FENG TAO;BHALLA ANUP;HO YUEH-SE |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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