| 摘要 |
In a substrate processing system for processing a substrate, such as a wafer W, held by a substrate holding device rotatable about a vertical axis, such as a spin chuck, a jig is placed on the substrate holding device, and centrifugal acceleration imparted to a predetermined measuring position on the jig and an eccentricity of the measuring position from the rotation center of the spin chuck are determined. The position of the rotation center is determined on the basis of centrifugal accelerations imparted to the measuring position when the jig is placed at three different positions and eccentricities of the measuring position from the rotation center when the jig is placed at the three different positions. Data on a substrate placing position, the center of the substrate placed at which coincides with the rotation center, is stored as data of a substrate placing position at which a substrate is to be placed.
|
