THE RADIANT HEAT CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A radiant heat circuit board and a method for manufacturing the same are provided to transfer heat from a heating device to a metallic plate directly by using the metallic plate including a metallic protrusion. CONSTITUTION: In a radiant heat circuit board and a method for manufacturing the same, a metallic plate includes a metallic protrusion(11) mounting a heat emission device(60). A plurality of insulating layers(20,30) are formed on the metallic plate. An insulating layer comprises a first insulation layer and a second insulation layer. A plurality of circuit patterns(40) are formed on the second insulation layer. The circuit pattern is formed by patterning a conductive layer laminated in the second insulating layer. A solder(50) is formed on a metallic protrusion. A heating device is formed in the solder.